Bona Materials bonding agents include T313, HX-878 and HX-752 for composite solid propellants and high-performance materials. T313 is used for epoxy curing, rubber crosslinking, semiconductor packaging, chip bottom filling and high-temperature insulation coatings. HX-878 is a cyanoethylated polyamine for nylon, epoxy and phenolic composites, anti-corrosion coatings, structural adhesives, sealants, magnetic powder and resin, and ceramic or carbon composites. HX-752 is listed for coating crosslinking and rubber modification.
